We have noticed that the demand for
Package on Package (PoP) is growing for PCB products manufactured for mobile
and handheld electronic applications. At our leading edge production facility, Geminitec
can support PoP device assembly. The use of tools such as solder jet printing
technology, with accurate Z-height paste control and high-end MYDATA surface
mount placement capability allows us to offer PoP technology within our surface
mount assembly process.
We can manufacture products with PoP
devices and complex PCB assemblies for rapid prototype and medium volume
orders. To find out more about our PoP assembly service please visit our
website or call us +44 (0)1252 333444.
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