In
2008, Gemini Tec were the first UK based CEM to introduce 'Solder Jet
Printing' technology for surface
mount PCB assemblies.
Today, we typically place in excess of 35000 BGA devices per year,
with comprehensive technology for 0.4 mm pitch BGA & PoP devices.
While adapting our technology by removing the many variables within
the paste and re-flow process, it allows room for a complex low to
batch PCB assembly. For more information please visit us at -
http://www.geminitec.co.uk
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