Friday 13 February 2015


Technical Solutions for RF PCB assemblies using world class solder jet printing technology.

Multilevel PCBs are here to stay...Jet printing provides the ideal method to deliver solder paste into a PCB board cavity.

One growing area of need is multilevel boards. To reduce the total height of the final assembly, it’s common to place the higher components in cavities on the PCB. Because jet printing makes use of a laser height sensor, height variations of up to a few millimeters can be handled with ease.

Gemini Tec provide its manufacturing services to a leading UK company, that specialise in the design and manufacture of solid state, high-power microwave and RF amplifiers. With a requirement to build high reliability products for global deployment, solder jet printing provides the technical solution.

Gemini Tec RF AssemblyWith our state-of-the-art MYCRONIC solder jet printers, Gemini Tec are able to successfully build and assemble specific and niche multi level PCBS.

The solder jet printing process can deliver a controlled and accurate amount of solder paste at multi-level positions (also known as cavities) across the RF PCB (printed circuit board) a technique not possible using traditional stencil techniques.
solder jet paste rf assembly



Achieving consistency across the pasted area at 0.2mm intervals to obtain 100% contact between the SMT device (located within the PCB cavity) and the PCB substrate for full connectivity is paramount to electronic performance.




This process is completed with a single pass through the solder jet printing system, removing the need to apply additional paste process techniques, which ultimately lead to variations on the finished PCB assembly.

The manufacturing process includes a highly accurate and controlled reflow process to ensure conformance.
All the devices/PCBs are subsequently inspected using 3D X-ray to confirm the metallic bond is correct.

The PCB assembly is currently in manufacture at over 500 systems per year, with a lower process cost than traditional solder paste techniques. The repeatability of the solder jet process ensures yields of 100%, allowing the full optimisation of the high value material costs.
 
We offer a range of solutions and services to manufacture surface mount and complex SMT assemblies, working closely with our customers at trusted supplier status.

If you require a technical solution, contact us today to find out more about how we can help your company.


Gemini Tec Ltd

1 The Brook Trading Estate
Deadbrook Lane
Aldershot
Hampshire
GU12 4XU
United Kingdom
+44 (0) 1252 333 444

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